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U-Bond Technology WAP

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Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26, 2003 with a registered capital of 60 million yuan. The company is headquartered in Dongguan City, Guangdong Province, with product development centers and manufacturing bases in South China and East China. The company has a professional customer service team and a sound sales network. It has offices in Yantai, Hefei, Chongqing, Wuhan, Xiamen and Southeast Asia, and subsidiaries in Taiwan, Hong Kong and the United States.

The company's products are diversified and are committed to providing customers with systematic product solutions. The main products are adhesives, electronic soldering materials, cleaning agents, material surface treatment agents, photoelectric chemicals, semiconductor special chemicals, automation equipment, environmental protection, etc., mainly for 3C, solar photovoltaic, power supply, LED and lighting, home appliances, automobiles Other industries provide specialized materials and solutions.

U-Bond Technology adheres to the market-oriented, integrates product research and development and technical services, and is committed to the research and development, production, sales and technology promotion of green environmental chemicals. U-Bond Technology continues to innovate with integrity and professionalism, continuously optimizes and responds quickly to customer needs; focuses on industry technology, provides diversified products for customers, and achieves multi-domain leapfrogging.

In the future, U-Bond Technology will continue to adhere to a professional attitude, relying on excellent R&D team and sales network to provide one-stop industry solutions for customers at home and abroad through the strategic layout of the market, and determined to become a professional material supplier.

 

 

· 2003 U-Bond Technology was established

· 2005 Dongguan Eunow was established

· 2006 Suzhou Eunow was established

· 2007 Jiangmen Tailian was established

· 2011 U-Bond Technology introduces PE institutions,苏州优诺认定为高新技术企业

· 2012 Suzhou Yunuo R&D institution was recognized as a municipal engineering center

· 2013 U-Bond Technology is recognized as a high-tech enterprise

· 2014 Dongguan Eunow is recognized as a high-tech enterprise

· 2015 U-Bond Technology and Dongguan Eunow R&D institutions are recognized as municipal engineering centers

· 2016 In January, the company was established. In June, the New Third Board was successfully listed. In December, U-Bond Technology acquired Dongguan Eunow and completed major asset restructuring.

· 2017 In February, the company was identified as a pilot company for the Dongguan Multiplier Program. In October, the company completed a private placement and raised funds of 108 million yuan. In October, the company was identified as a listed company in Dongguan.

· 2018 In January, the New Third Board was delisted. In February, maintain the double qualification. In July, the automation company was established. In August, Zhuhai U-Bond was established.

 

 

2003 Year
U-Bond Technology was established
6000 Ten Thousand
U-Bond Technology Registered Capital
86000
Total area of the factory
10000 +
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