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3C Industry Solutions

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U-Bond Technology WAP

3C Industry Solutions

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Number
EUP-1000HQR
Application Field
Server,notebook and desktop computer.
Packing Specification
500g
Key words
Number
UB-3301
Application Field
1.Power supply: red adhesive on the power board; 2.Home appliances power: SMT stencil printing red adhesive
Product Features
1.Suitable for lead-free soldering process. 2.Especially suitable for small size components high speed mounting. 3.Longer stencil open time. 4.High speed dispensing.
Packing Specification
30ML/300ML
Key words
Number
UB-4305
Application Field
Computer and handheld devices: BGA peripheral fixed protection
Product Features
1.Curing in a few seconds by UV irradiation, no need to heat curing, greatly improving work efficiency; 2.Excellent adhesion to most materials such as plastics, glass, and metal; 3.Not corrosive to electronic components;Thixotropic properties reduce the flowing of liquid products after applying adhesive
Packing Specification
30ML/55ml/1L
Key words
Number
AC108
Applicable process
Heating soak
Cleaning object
Cured Epoxy adhesive
Application Field
Used for underfill rework cleaning
Packing method
1L/Bottle
Key words