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New Energy Industry Solutions

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U-Bond Technology WAP

New Energy Industry Solutions

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Number
UB-3301
Application Field
1.Power supply: red adhesive on the power board; 2.Home appliances power: SMT stencil printing red adhesive
Product Features
1.Suitable for lead-free soldering process. 2.Especially suitable for small size components high speed mounting. 3.Longer stencil open time. 4.High speed dispensing.
Packing Specification
30ML/300ML
Key words
Number
UB-518SM
Application Field
1.Solar: bonding and fixing of battery components. 2.LED and lighting equipment: sealing/bonding of T8 lamp cap;bonding sealing of display aluminum frame
Product Features
1.Simple and easy to operate. 2.Good cold and heat resistance. 3.Environmentally friendly.
Packing Specification
300ml/2600ml
Key words
Number
UB-518SL
Application Field
LED and lighting equipment:Coating of Control board
Product Features
1.Suitable for coating processes such as dipping and brushing 2.Provides excellent moisture protection for board assemblies
Packing Specification
3.5KG
Key words
Number
UB-5203A/B
Application Field
Power: thermal potting of the adapter
Product Features
1.High production efficiency. 2.Hhigh liquidity. 3.Flame retardant materials.
Packing Specification
A 5KG, B 25KG
Key words