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Automation Equipment Solutions

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U-Bond Technology WAP

Automation Equipment Solutions

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1、Camera Dispensing

 

Process characteristics: camera module mainly includes FBC, Image Sensor / CMOS, IR Filter, Holder, Lens Set, Substrate, voice coil motor (VCM), printed circuit board (PCB), etc., the internal structure is precise, the required precision is high, and many components need to be dispensed.

At present, Camera module dispensing difficulties: The device cannot achieve accurate positioning, contact dispensing such as syringe has high defect rate, and the equipment cost is high.

Solution:

U-BOND camera module dispensing solution for you:

Humanized design work interface, simple and convenient operation

Accurate positioning of CCD vision for precise dispensing and improve product quality

Spray valve dispensing system, precisly control of the amount of adhesive, to meet different dispensing requirements

 

2、Cip Dispensing

 

Process characteristics: In the production of automobiles, not only soldering, electric soldering and other processes, but also a large number of bonding processes will be used. Bonding includes a variety of bonding of electronic components in the car such as PCB chip, sensor and camera. The automatic dispenser can replace manual dispensing to achieve automated production to meet production needs.

 

Solution:

U-BOND camera module dispensing solution for you:

Humanized design work interface, simple and convenient operation

Accurate positioning of CCD vision for precise dispensing and improve product quality

Dispensing system: professional dispensing controller, equipped with different dispensing valves to meet different dispensing requirements.

 

3、Battery Pack Potting

 

Industry introduction: With the development of electric vehicles, battery packs are the source of power for new energy vehicles. The safety of their performance directly determines the safety of the whole machine. Therefore, the structure of the battery pack sealing waterproof, potting heat transfer and other functional design put forward higher requirements, the functional requirements of the bonding material also increased. In order to meet the different requirements of customers with different bonding materials, U-Bond Automation designs online potting machines for this industry to provide solutions for customers.

 

Solution:

In order to meet customer requirements, complete online work. We have adopted a three-axis motion control solution.

Touch screen operation interface, easy to learn and understand;

With points, lines, faces, arcs, circles, irregular curve continuous tween and three-axis linkage, can adapt to any irregular object potting;

Various parameters are adjustable, the amount of adhesive is stable, and the glue is not leaking.

Optional CCD vision programming system for fast programming;

Three functions of adhesive, potting and track potting are integrated, fully automatic operation;

On-demand ratio, the volumetric online proportioning method is adopted to realize the adhesive mixing while mixing, and the adhesive is saved to the maximum extent;

Mixing system, AB valve + mixing hose, make the glue mix evenly and fully;

Fully automatic assembly line operation, which can connect equipment such as docking station and curing oven;

The storage tank is equipped with a liquid level sensor switch, and the material is automatically alarmed;

With heating function, consisting of PID temperature control, temperature measurement platinum resistance, digital temperature control table.

Number
OL841
Applicable Adhesive
One-component adhesive for hot melt adhesive, UV adhesive, silicone, red adhesive, underfill
Application Field
Precise fine coating of PCB 、 FPC and micro lens , underfill of chip, and precision dispensing process for mounting adhesive bonding
Key words
Number
Applicable Adhesive
Low viscosity two-component Adhesive such as epoxy , PU , and Silicon
Application Field
Semiconductor package、Semiconductor package, PCB parts fixing and protection, LED potting, battery box potting, auto parts potting, hardware parts packing potting, quantitative liquid filling.
Key words