Search
-
-
Semiconductor Specialty Chemical Solutions

Copyright © 2018 Dongguan U-Bond Material Technology Co., Ltd. All Rights Reserved

U-Bond Technology WAP

Semiconductor Specialty Chemical Solutions

Page view

 

Number
EUP-159
Application Field
POP process
Packing Specification
30g
Key words
Number
ES151
Applicable process
Etching
Application Field
Acidic water-based product.ITO function sheet etching solution.Soak to use.
Packaging specification
25KG/Barrel
Key words
Number
C-79
Applicable process
Ultrasonic cleaning
Cleaning object
Post-weld residue
Application Field
Without flash point.Good compatibility with sensitive metals.Suitable for post-weld residual cleaning
Packing method
20L/Barrel
Key words
Number
C-55
Applicable process
Offline spray
Cleaning object
Solder paste
Application Field
Strong cleaning ability and good compatibility with related materials
Packing method
20L/Barrel
Key words