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Copyright © 2018 Dongguan U-Bond Material Technology Co., Ltd. All Rights Reserved

U-Bond Technology WAP

U-BOND adhesive solutions
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comprehensive adhesive solutions
New Generation Low Temperature Solder Paste
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Low temperature solder paste 
U-Bond Technology adheres to the market-oriented, integrates product research and development and technical services, and is com
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U-Bond Technology adheres to the market-oriented, integrates product research and development and technical services, and is committed to the research and development, production, sales and technology promotion of green environmental chemicals. U-Bond Technology continues to innovate with integrity and professionalism, continuously optimizes and responds quickly to customer needs; focuses on industry technology, provides diversified products for customers, and achieves multi-domain leapfrogging.
The company's products are diversified and are committed to providing customers with systematic product solutions.
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The company's products are diversified and are committed to providing customers with systematic product solutions. The main products are adhesives, electronic soldering materials, cleaning agents, material surface treatment agents, photoelectric chemicals, semiconductor special chemicals, automation equipment, environmental protection, etc., mainly for 3C, solar photovoltaic, power supply, LED and lighting, home appliances, automobiles Other industries provide specialized materials and solutions.
Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26,
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Dongguan U-Bond Material Technology Co., Ltd. (hereinafter referred to as “U-Bond Technology”) was established on September 26, 2003 with a registered capital of 60 million yuan.
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